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High Temp Cured Back-Up Structure

  Material   Carbon/Epoxy Laminate
  Max Tg (DMA)   400ºF (191ºC)
  Flexural Strength/Modulus Strength @ RT   121.9 ksi (8.9 msi)
  Flexural Strength/Modulus Strength @ 350ºF   49.8 ksi (7.4 msi)
  Flex Str./Mod Str. @ RT after 100 thermal cycles   122.8 ksi (9.1 msi)
  Flex Str./Mod Str. @ 350ºF after 100 thermal cycles   58.7 ksi ( 8.1 msi)
  CTE, X-Y (by TMA, um/mdegºC)   2.34 to 2.91

Technical Data Sheet